Socionext Inc. has acquired Bayside Design Inc. (BDI), a U.S.-based supplier of package design services, through Socionext America Inc. (SNA), its U.S. subsidiary. BDI started operations as a 100% owned subsidiary of SNA on January 1, 2016.
Previously, development of SoC (System-on-Chip) design flow mainly focused on optimizing the layout of in-chip elements, such as transistors and interconnects. With the increasing demand for higher functionality and performance, it is becoming necessary to pay more attention to the chips’ packages, and to the printed circuit boards (PCB) where these packages are mounted. A new methodology, Chip-Package-PCB co-design, helps companies cost-effectively meet today’s performance, functionality and time-to-market requirements. This methodology is expected to become more important in the future.
BDI has extensive experience and expertise in quickly delivering high-quality package designs for high-speed, high-performance SoCs.
Socionext is providing SoC-based solutions to a variety of markets that require such high-quality SoCs, such as IT infrastructure (e.g., servers, storage systems, and networks), consumer and industrial equipment and the Internet of Things (IoT). By implementing BDI’s technologies within its product design, Socionext will be able to more quickly provide high-performance, high-quality products and services to the global market.
This is part of the Socionext commitment to continually enhance the quality of its designs and to meet the challenge of new technologies, thus helping its customers deliver more valuable products and services.